tflex ? 700 series thermal gap filler features and benefits ? thermal conductvity 5.0 w/mk ? highly compliant ? low thermal resistance even at low pressure ? available in thicknesses from 0.020 thru 0.200 (0.5mm thru 5.0mm) ? naturally tacky for adhesion during assembly and transport highest thermal conductivity compliant gap filler tflex? 700 is a 5 w/mk soft gap filler thermal interface material with great thermal performance and high compliancy. the soft interface pad conforms to component topography, resulting in little or no stress on the components and mating chassis or parts. unique silicone and ceramic filler technology allows a combination of high compliancy and high thermal performance. tflex? 700 is stable from -45oc thru 200oc and meets ul 94v0 flame rating. naturally tacky, it requires no additional adhesive coating which inhibits thermal performance. applications ? cooling components to chassis, frame or other matng components ? mass storage devices ? heat pipe thermal solutons for notebook computers ? automotve engine control ? telecommunicaton hardware ? led solid state lightng ? power electronics ? flat panel displays ? audio and video components ? computer servers and other it infrastructure ? gps navigaton and other portable devices americas: +1.800.843.4556 europe: +49.8031.24600 asia: +86.755.2714.116 clv-customerservice@lairdtech.com
thr-ds-tflex-700_07_2_14 any information furnished by laird technologies, inc. and its agents is believed to be accurate and reliable. all specifications are subject to change without notice. responsibility for the use and application of laird technologies materials rests with the end user, since laird technologies and its agents cannot be aware of all potential uses. laird technologies makes no warranties as to the fitness, merchantability or suitability of any laird technologies materials or products for any specific or general uses. laird technologies shall not be liable for incidental or consequential damages of any kind. all laird technologies products are sold pursuant to the laird technologies terms and conditions of sale in effect from time to time, a copy of which will be furnished upon request. ? copyright 2010 laird technologies, inc. all rights reserved. laird, laird technologies, the laird technologies logo, and other marks are trade marks or registered trade marks of laird technologies, inc. or an affiliate company thereof. other product or service names may be the property of third parties. nothing herein provides a license under any laird technologies or any third party intellectual property rights. a15955-00 rev e, 7/2014. standard thicknesses standard thickness 0.020 (0.5mm) through 0.200 (5.0mm) available in 0.010 (0.25mm) increments. material name and thickness tfex? - indicates elastomeric gap fller product line. 7xxx - indicates tfex? 700 product line and thickness in mils (0.001-inches). -dc1 - one side tacky; default is both sides tacky. data for design engineer guidance only. observed performance varies in applicaton. engineers are reminded to test the material in applicaton. tfex? 700 test method constructon filled silicone sheet n/a color dark grey visual thermal conductvity (w/mk) 5.0 hot disk? hardness (shore 00) 66; 3 astm d2240 specifc gravity 1.73 helium pyncometer thickness range 0.020 - .200 (0.5 - 5.0mm) thickness tolerance 10% ul flammability ratng 94 v0 file e180840 temperature range -45c to 200c see reliability report volume resistvity (ohm-cm) 1 x 10 13 astm d257 outgassing tml 1.0% astm e595 outgassing cvcm 0.13% astm e595 tflex ? 700 series thermal gap filler
|
